Escalating tensions between the US and China are having a marked influence on CEO confidence and the industry outlook. Who are the key technology suppliers that stand to gain from the revenue growth over the coming years? His main interest areas are advanced IC packaging technology including equipment & materials. Jiangsu CAS Microelectronics Integration Technology Co Ltd, CASMEIT, was founded in Xuzhou city, Jiangsu province in March 2018, where Dr. Yao currently serves as CEO. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage and memory,sensors and connectivity. TRUMPF´s innovative process power solutions help tool makers and chip makers to overcome daily challenges like wafer to wafer uniformity, controllability of critical dimensions as well as reducing operational cost over the lifetime. As technology nodes scale down and density of memory goes up, it presents key challenges to provide effective packaging and test solutions. In 2013, he was appointed Counsellor to the French Government on foreign trade matters. 17.04 ~ Now GM & EVP of Substrate Solution Business Unit in Samsung Electro-Mechanics Co., Ltd. 14.12 ~ ‘17.03 Head & SVP of Global Technology Center in Samsung Electro-Mechanics Co., Ltd. 12.12 ~ ‘14.11 GM & Head of Manufacturing Technology Center of System LSI Business Unit in Samsung Electronics Co., Ltd. 10.08 ~ ‘12.11 GM & SVP of Texas Austin FAB of System LSI Business Unit in Samsung Electronics Co., Ltd. 07.01 ~ ‘10.07 VP of Manufacturing Technology Center of System LSI Business Unit in Samsung Electronics Co., Ltd. Dipl.-Ing. Enabling Value Creation through Technology, Supply Chain Management & Scaling. He also serves on the board of Akshaya Patra, the world’s largest NGO dedicated to feeding school children. toward superior performance, yield and reliability. Vehicle EE Architecture: centralized High-Performance Computer and core enabler Software, The intelligent connected vehicle (ICV) continuously drives the change in E/E vehicle architecture. Microelectronic Packaging goes Heterogeneous Integration. In 2016, He was in charge of General Purpose Analog & Power business of Renesas and led it revenue turnaround until its consolidation with Intersil business which was acquired in 2017 February. Please visit our parent site to view the latest webinars. Sébastien Bernard was born in France in 1970 and graduated with a Master’s degree in Semiconductor Devices Technology from Ecole Centrale de Lyon in France, after conducting a research work on semiconductor material at Tsinghua University, Beijing, in 1994. Additionally, he was the founder and CEO of Twin Creeks Technologies, a solar panel and equipment company. Mr. Graf is mainly responsible for marketing and investor relations and organises the public presentation of 0eC. Before entering the company, Michael took the position of the division manager in SICK AG and was the product manager in Draeger AG between 1990 and 1992. 5G、数据中心和人工智能等这些重要的应用市场正在推动对系统内存和存储的巨大需求。随着晶圆制造技术节点的进化和存储密度的增加，封装和测试解决方案也面临着关键挑战。在这次介绍中，我们将就一些关键问题进行讨论并提供建议，希望给解决不断发展的存储器封装和测试市场的需求提供帮助意见。, Senior Director Production Partner Procurement, Infineon. Currently Donghui Lu is Senior Director of Process Development for NSG (Non-Volatile Memory Solutions Group) at Intel, managing Process Development organization (based in Dalian, China) to develop future generations of 3D NAND process technologies. Under his leadership a full industrial compatible process line for Wafer level Packaging and 3D integration was established. Required fields are marked *. By some measures, Kirin is as competitive as chips made by commercial rivals Qualcomm and Samsung. VP of Manufacturing & GM of East Fishkill 300mm-Fab, ON Semiconductor. Prior to his work with 0eC, he was working in the telecommunication and automotive branch as a system engineer and a freelance IT consultant for more than 10 years, and he has worked in projects for process analysis and customisable system administration. Since 2011, he is head of the department “Wafer Level System Integration” and also continued managing the center ASSID featuring a 200/300 mm 3D wafer level integration line. 曹持论于2001年安靠上海成立初期加入公司，先后担任技术、生产等多个重要岗位，在接任总裁之前担任安靠上海厂长一职，参与并见证了安靠上海从设立到发展壮大的全过程。他有着25年的集成电路封测产业技术和管理经验，是中国大陆首批掌握中高端集成电路封装技术的先行者。加入安靠之前，曹持论曾在Hyundai Electronics，STATSChipPAC等公司工作。曹持论拥有上海工程技术大学热能工程学士学位以及美国德克萨斯大学阿灵顿分校EMBA学位。, Addressing Packaging Challenges for Growing Memory Market / 如何应对不断发展的存储器市场所面临的封装挑战. Economics, Politics and Public Policy in East Asia and the Pacific, Keeping an eye on US–China semiconductor supremacy struggles, Semiconductor tech war underlies the Japan–South…, How China’s ‘technological independence’ strategy…, Supply chains critical to Taiwan's security, China’s ambitious innovation approach to growth, The fallout from the Japan–South Korea trade ruckus…, Progress and challenges for science and technology in China. From 2000 until 2010 he additionally took over the position of personal assistant for the director of Fraunhofer IZM – Prof. Dr.-Ing. Opportunities in next generation advanced bonding and molding technology. Delegates must adhere to the deadlines set out by the Operations Manager. Dr James Ong is Managing Director and Co-Founder of Artificial Intelligence International Institute (AIII), a think tank focusing on Sustainable AI. Our webinars provide opportunities for political, business, financial, research and industry decision makers to uncover deep, expert insights into the semiconductor industries remotely, without any need to travel. He is the author of several reports covering various packaging platforms, equipment, and materials. Farhat holds a Master of Science degree in Electrical Engineering from University of Arkansas at Fayetteville. Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the CEO of Xiamen Sky Semiconductor Co., Ltd. In addition to his devotion in research activities, Steve is a promotor of technology commercialization. Karl has a master’s degree and a summa cum laude Ph.D. degree in computer science from Technical University of Munich. Babak Sabi is the Corporate Vice President and General Manager of Assembly and Test Technology Development. MD and Co-Founder / 院长与联合创始人 AI International Institute / 人工智能国际研究院. Save my name, email, and website in this browser for the next time I comment. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging. We first look at the preferred fan-in WLP structures based upon reliability performance. Prof. WEI received Master degree in Engineering from the Department of Radio and Electronics, Tsinghua University, Beijing, China in 1984 and Doctor degree in Applied Science in 1991 from the Laboratory of Electronics, Faculté Polytechnique de Mons, Belgium and then became the assistant professor in the same laboratory. Non–appearance of any of the Delegates will not affect your obligation to pay in accordance with the terms set out below (5). As a result, AI is no longer viewed as a simple technical tool but rather, has triggered holistic transformation for the entire organization. In 2017 Donghui was Program Director building the biggest single cleanroom for Intel in Dalian in record 9 months at world class cost. Michael’s keen understanding of technology and market opportunities and his unparalleled ability to lead and motivate teams, drive transformation and fast response to market transitions and increase customer relevance and growth. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. China’s semiconductor industry faces considerable challenges in reaching global leadership status. Chairman of technical committee at Networking for Autonomous Vehicles (NAV) Alliance. Such a method balanced well the manufacturing cost and module performance with the smallest packages. M. Juergen Wolf is a member of IEEE and SMTA and among others, a longstanding member and European representative in different technical international packaging groups e.g. Dr.-Ing. From 1998 to 2005, he worked for Datang Telecom Technology Co., Ltd. successively as Vice-President, President & CEO. All prior agreements understandings and negotiations and representations (save for fraudulent misrepresentation) whether oral or in writing are cancelled in their entirety. As AI accelerates the pace of enterprise innovation, it has transformed business automation from simple tasks to become a very powerful tool for Human-Machine Collaboration. Dr. WEI is now professor of Tsinghua University and adjunct professor of Peking University. Tim started his career in semiconductors at Motorola where he led creation of PRISM, an advanced assembly and test CEO model factory, which delivered two major innovations to the semiconductor industry: strip-based final test and integrated 2D codes for product tracking and traceability. Principal engineer and architect, IRDS More Moore Global Chair, IEEE, Qualcomm. 2. IC China is a global platform of int. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. On-package integration provides a compact, power efficient platform for Heterogeneous Integration of diverse IP that support faster time to market and cost/yield benefits. This presentation will highlight some of the new opportunities in bonding and contact technology including Thermal Compression Bonding and Direct Cu-to-C hybrid bonding as well covering advancements in molding technology for advanced packaging. The requirements and time to market for these applications vary based on packaging complexity, electrical, thermal, reliability, quality and process control. The trade war is a reminder for Chinese leadership that it can no longer rely on imports and must develop in-house core technology and pursue technological leapfrogging, especially in essential components such as semiconductors. TMSC’s success also owes much to its founder, Morris Chang, a Chinese-born engineer with 25 years of experience in a leading US semiconductor firm before being recruited by the Taiwanese government to start TMSC in 1987. We will discuss two other industry-shaping topics. We’re committed to advancing future semiconductor manufacturing by driving innovation, business and investment opportunities. Siva has more the 25 years’ experience in the global semiconductor industry. 941 Exhibitors. He has authored or co-authored more than 200 peer-reviewed technical publications and holds more than 70 patents. M. Juergen Wolf received a M.S. He is also the Researcher in the State Key Laboratory of Mobile Network and Mobile Multimedia Technology. 1. Prior to joining Evercore, Mr. Stokes was a Managing Director in the Investment Banking Division at Goldman, Sachs & Co., where he served as global head of Electronics and Industrial Technology Investment Banking. Prior to joining Renesas, Maoka led Post Merger Integration at Lenovo which acquired NECs personal computer business through Joint Venture structure. He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. A global semiconductor shortage and tensions with China have bolstered U.S. scrutiny of the supply chain and created a drive to regain leadership. ams’ novel Digitized Lateral Flow Test will enable fast, objective results that give very early insight on outbreaks. By Ding Yi / Feb 23, 2021 12:26 PM / Economy. Key areas to be addressed are design for reuse, higher abstraction levels to intellectually understand a complex system, agility along with model/design execution and a high professionalism in software development, Vice President, TRUMPF Huettinger Elektronik GmbH. Clients represented by Mr. Stokes include Advanced Energy, Aeroflex, Anaren, AZ Electronic Materials, Belden, Brooks, CDW, Cobham, Corning, Dover, Edwards, Entegris, Fortive, Freescale, IBM, Lam Research, Lexmark, Macom, Molex, Keysight, Koch Industries, TE Connectivity, Samsung, Sensata, Solectron, Tokyo Electron, Universal Display, Viasystems and Vishay, among others. Sabi received his Ph.D.in solid-state electronics from Ohio State University in 1984. Steven Craig is the Senior Vice President and General Manager for China Go-to-Market. Electrical Engineering, distinction in major, Cum Laude, 1992. Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He founded the Chengdu R&D center and expanded from 0 to around 50 employees. China announced tax breaks Monday to spur growth of its semiconductor industry following U.S. sanctions that alarmed the ruling Communist Party by cutting off access to American processor chips for tech giant Huawei and some other companies. The need for miniaturization has led to new architectures, which combine a whole range of different technologies. Links to other websites are provided for the user’s convenience. Big data requires abundant computing, communication bandwidth, and memory resources to generate the service and sensible information that people need. Sébastien joined STMicroelectronics in 2000 and has held various management positions in Corporate Strategy, Strategic Partnerships, Sales and Marketing, and Business Development. China International Semiconductor Expo (IC China 2021) is an exhibition that presents products and services in categories such as: China International Semiconductor Expo (IC China 2021) will be held in Shanghai, China on 27-29 Sep 2021. GaNFast Power IC for AC/DC power converter. The rise of the high growth tech SPAC IPO is enabling young companies to raise large amounts of capital. Software excellence will become a key-enabler to master highest complexity. Driven by government support, vast market and increasing R&D spending, China, Japan, South Korea and Taiwan together have become the “Big 4” semiconductor players in Asia Pacific. We are living in a connected world with access to data in vast amounts. He has also initiated the annual 3D European Summit Conference where he is a member of the steering committee. There are plenty of lessons to be learned on how all the stakeholders should collaborate to ensure a sustainable development of the AI ecosystem and focus on areas where we should innovate towards a future with Sustainable AI. More Moore roadmap for high-performance computing enablement – IRDS view. degree in Materials Science from University of Rochester, NY, United States. Wafer level packaging (WLP) technology has progressed rapidly though fan-in, fan-out, and 3D packages. Beside the development of new processes and the implementation of new materials heterogeneous integration requires an overall approach which includes design and reliability tasks. He will be based in Shanghai, China. In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. Donghui received Bachelor’s degree from Tsinghua University in Beijing in 1994, and PhD from The Ohio State University in Columbus, Ohio in 2000, both in Materials Science and Engineering. The content of this website may be changed at any time without notice. The new class of devices consist of a 650V Enhanced Mode Monolithic (All-GaN) Power IC targeting ultra-high frequency AC/DC power adapter. He joined ZTE Microelectronics in 2015 as AI Chief Scientist and Director of Engineering, where he is in charge of AI, autonomous driving, AR/VR, and multimedia chip designs. GM & EVP for Advanced Optical Sensors Division, ams. Wallace is a real ‘people person’ with very strong communication skills. China Still Far From Semiconductor Self-Sufficiency, Report Says. Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. The most powerful chips pack as many transistors as possible into increasingly smaller and more efficient chips. Curtis is Past General Chair of the International Wafer Level Packaging Conference 2016-2018 and the 2019 General Chair for the IMAPS Symposium on Microelectronics. He has jointed SPIL since 1998 and led the R&D advanced packaging design team for leadframe, substrate and wafer form packages development. CAD has three businesses: Environmental and Process Monitoring (EPM), Mineral and Material (M&M) and Field Security Instrument (FSI). EVP of National Silicon Industry Group, Chairman of Zing Semiconductor Corporation & SIMGUI Technology 上海硅产业集团股份有限公司执行副总裁、上海新昇及新傲科技董事长. He currently holds 2 patents. Mr. Morales will share his perspective on these key questions and provide guidance to technology companies in order to capitalize on the opportunities in store for the semiconductor industry over the next five years. Ms. Orlando went on to run a division of Duramax, leading projects for major industrial entities, defense contractors, and branches of the military. In addition, zonal architectures bear significant savings in length of the wiring harness. Dean Sha has served as the Head of Business for China at AtoS, , Europe’s largest consulting firm, He was also global head of the renowned company CDI, a top 3 strategy consulting firms in Japan. Especially, advantages of higher production efficiency, more advanced process, better supply chain, and cost-efficient in CMOS compatible manufacturing are achievable in 8 inch GaN on Si. Were the Philippines’ COVID-19 responses sufficient? In this presentation, we will address some of the key issues and provide recommendations that will address the ever evolving memory packaging and test market. Steven has a rich experience and demonstrated leadership in customer support. After university, Karl joined for 3 years the central research and advanced development organization of Siemens where he worked on automatic test pattern generation techniques for different failure models, synthesis for testability in cooperation with university of Berkeley, and the application of build-in-self-test methods in VLSI circuits. Innovative Process Power Solutions for Semiconductor Industry. The advantages of wafer level TGV packaging technology include small form factor, low cost, simple process, and excellent electrical performance.
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