MSD has four businesses: Material Science (MS), Life Science (LS), Spectroscopy (SPEC) and Semiconductor (Semi). A new approach to reach 25 Tbps/mm and more. degree in Metal Materials & Heat Treatment from Huazhong University of Science and Technology with honor of outstanding graduate, M.S. In this presentation, we will address some of the key issues and provide recommendations that will address the ever evolving memory packaging and test market. He is the managing director of the Avago Technologies Fiber GmbH in Germany, Avago Technologies Fiber Austria GmbH and a member of the supervisory board at the Munich based MIC AG, an early stage investor for high tech companies. We will discuss two other industry-shaping topics. James is also an entrepreneur, community builder and adjunct professor at SUTD (Singapore University of Technology and Design). From 1998 to 2005, he worked for Datang Telecom Technology Co., Ltd. successively as Vice-President, President & CEO. E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. Taiwan’s lead in semiconductors is a story of focusing capabilities in a segment rather than the entire supply chain. Mr. Phil Amsrud, a senior principal analyst at IHS Markit, covering the automotive semiconductor market in general with a special focus on advanced driver-assistance systems (ADAS) and autonomous driving. M. Juergen Wolf is a member of IEEE and SMTA and among others, a longstanding member and European representative in different technical international packaging groups e.g. China supplies just 30 per cent of its chips domestically. The Taiwanese government sent its first batch of engineers to the United States for training in the 1970s, who later returned to help build Taiwan’s semiconductor foundry. Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. She is an IMAPS Fellow. Mr. Stokes received his BA, MA and MEng degrees (First Class) in Engineering from Cambridge University and received his MBA degree from Kellogg School of Management. Phil began his career in automotive electronics as a design engineer at GM on their ABS systems. with rich experience in advanced packaging design, simulation and assembly process. How sustainable has the recovery been for semiconductor suppliers this year in spite of COVID? Instant data generation requires ultra-low-power devices with an ìalways-onî feature at the same time with high-performance devices that can generate the data instantly. He has over 20 years R&D experience in materials and semiconductor packaging development, especially in wafer level package and advanced packaging. and M.S. Jennifer Zhao joined ams AG as EVP and GM for Advanced Optical Sensors Division in 2017. Prior to joining Quantenna, Mr. Jahangir served as head of Operations and Quality at Synerchip / MultiMedia Crossing (IP later acquired by Silicon Image Inc.) where he oversaw high-speed, mixed-signal IC and system products from concept to end-of-life. David Fang - CTO & VP, Powertech Technology Inc. Steve Hah - EVP Head of Substrate Solution Business Unit, Samsung, Jürgen Wolf - VP Advanced Packaging, Fraunhofer IZM-ASSID, Farhat Jahangir - SVP, Manufacturing & Quality, Quantenna. Wim worked with companies such as Micronas, Trident and NXP and joined ams in 2019 as VP and GM of BL Accessory and Wearable Solutions covering innovations and product developments in the area of Vital, Spectral and Audio. He started working in the semiconductor industry in 1984 at ASM in Bilthoven, the Netherlands, in front end equipment including Epi, Diffusion, PECVD Implant and Litho and was also involved in the sales of the first steppers from ASML (at that time part of ASM). Engineer calls for joint efforts in developing semiconductor industry By Zhu Bochen 0 Comment(s) Print E-mail China.org.cn, April 6, 2021 He also has experience in global manufacturing operations, supplier management, new product development, and the assurance of quality and reliability processes. China's most important chipmaker SMIC could be a big winner from the global semiconductor shortage Published Mon, Mar 1 2021 9:58 PM EST Arjun Kharpal @ArjunKharpal Advanced packaging is becoming a key enabler for next generation semiconductor devices. Before joining Navitas, Marco led the Energy Saving Product – Design Center at International Rectifier developing innovative products for Off-Line application like motor drive, AC/DC, DC/DC converters. Mr. Morales will share his perspective on these key questions and provide guidance to technology companies in order to capitalize on the opportunities in store for the semiconductor industry over the next five years. He has also initiated 12” wafer level bumping project in Korea transferring the technology to Singapore working with EDB, Chartered (now Global Foundry) and also UTAC to set up the joint venture as 1st 12” bumping company in Singapore. 3D integration technology is the main solution that can meet the required performance of applications like AI and HPC. Phil also served as new business development manager for the Americas at BAE Systems/Fairchild Imaging prior to joining IHS Markit. Julio spends his personal time with his children and volunteering in youth enrichment programs such as Assistant Scout Master for Boy Scouts of America, and coaching youth ice hockey. Wang Yu-Po received Ph.D. in Mechanical Engineering from State University of New York at Binghamton, U.S.A. Jiangsu CAS Microelectronics Integration Technology Co Ltd, CASMEIT, was founded in Xuzhou city, Jiangsu province in March 2018, where Dr. Yao currently serves as CEO. Our primary goal in collecting personal information from you is to give you an enjoyable customised experience whilst allowing us to provide services and features that most likely meet your needs. 3 Feb 2021 - 4:12AM M. Juergen Wolf received a M.S. It discusses how the path from SoCs to SiP Solutions helps reduce the high cost of IC development and manufacturing, and also create new possibilities, and how some of the latest inter-chiplet PHY technologies that enable this trend. He served various senior roles as Staff/Algorithm Engineer, Chip Architect, Research Scientist, in different companies from startups to Fortune 500 such as IBM and Qualcomm, in China, Canada, and the USA. This presentation will discuss the trends and challenges of the FCBGA ecosystem and the three value creation roles OSAT’s play. He is now over 10 years active at Besi. The entire world got disrupted early this year with the Covid-19 virus spreading all over the place. The attempt to “contain: China is writ large and clearly in both the professional literature as well as the anecdotal. During his staying in Singapore, he has worked with international customers in US, European Fabless, IDM companies and Taiwan foundries. In the future, companies will place human-machine collaboration as their core strategy and will embrace these technology tools and methodologies for business improvement by enabling better understanding and interactions between humans and machines. He holds 2 US patents. The rise of the high growth tech SPAC IPO is enabling young companies to raise large amounts of capital. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. He has engaged in several startup projects, including AI and app development, where he has implemented agile methods and taken the lead in company building. As an experienced executive in the semiconductor industry for over 30 years, Simon served as the CEO of XMC, COO/CTO of SMIC, and CTO/SVP of Chartered Semiconductor (Now GlobalFoundries), in charge of fab operation and technical R&D. In particular, he was instrumental in leading a global corporate carve out to Lenovo in Asia, Europe and the US. Delegates must attend all prescheduled Event meetings and the seminar programme. Dr. Fuchs did 17 publications, mainly IEEE, during his research work at the university of Munich and the research center of Siemens. Semiconductor Manufacturing International Corp. (SMIC), China’s largest and most advanced chip fab, only recently gained the ability to produce chips based on a … He was especially responsible for the development, coordination and implementation of new technologies for wafer level packaging and system integration. Martin Weigert worked for Siemens/ Osram / Infineon / Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He has authored and co-authored numerous scientific papers presentations and reports in the field of microelectronic packaging and holds a number of patents. The advantages of wafer level TGV packaging technology include small form factor, low cost, simple process, and excellent electrical performance. As part of the HPE Pointnext Services team, Gaurav works with customers in their ArtificiaI Intelligence and Machine Learning transformation projects from infrastructure to application level. Ben Zhou has more than 20 years of commercial experience in China and APAC region, and 3 years of VP/GM of a global business. To move up global value chains, it should focus on other areas such as artificial intelligence chips — a new technological field with fewer established incumbents. In 2013, he was appointed Counsellor to the French Government on foreign trade matters. And develop the RF , MEMS and memory etc. The applicable VAT rate will be charged in addition to the Total Cost. She received her master degree in Engineering Management & Industrial Engineering from Stanford University and an M.B.A. from Harvard Business School. This agreement is governed by and will be construed in accordance with English law and each party irrevocably agrees that the courts of England will have the non-exclusive jurisdiction to deal with any disputes arising out of or in connection with this agreement. System integration, performance, cost and enhanced product functionality form the major driving force behind contemporary innovations in packaging. He has been working on end-to-end development, technology transfer, NPI & high volume production in FBGA, QFN, QFP, MEMS and Memory package in STATS ChipPAC. China should aggressively pursue domestic self sufficiency for all of its needs related to technological advancement. These are the conditions of the contract between you, the Client (“You” and “your”) and China International Semiconductor Executive Summit (“CISES”, “we”, “us” and “our”) governing your use of our services, including event attendance as set out in your booking form. Tim holds over two dozen issued United States patents relating to packaging, software, equipment, process, and design. He was the founder, President & CEO and Chairman of the Board of Datang Microelectronics Technology Co., Ltd. from 1996 to 2005. 季明华博士，从加州大学伯克利分校获得博士学位(1982)，拥有38年的国际半导体产业经验，专注于半导体先进技术的研发。曾发表过半导体技术期刊和会议论文99篇，合著书3册, 拥有美國专利257项, 国际专利超过550项。, 季明华博士曾工作于Intel (1982-1989); KFI 技术（1989-1994），美国国家半导体 (1994-1997); 台湾积体电路Tsmc (1997-2005)任资深研发总监; GLOBAL-FOUNDRIES (2011-2015) 任资深技术专家/总监; 中芯国际（2006-2011, 2015-2018）, 和芯恩 (青岛) 集成电路 (2018 )任资深副总。负责20nm平面CMOS相关的技术开发，14nm FinFET技术的器件整合和模块工艺，并参与10nm/7nm FinFET的技术开发。, 季明华博士曾获得台积电杰出专利奖、美国国家半导体公司创新奖、英特尔杰出成就奖等荣誉，并担任青岛大学 和北京大学“兼职教授”、中科院微电子研究所“荣誉教授”、复旦大学“荣誉教授”、美国IEEE终生资深会员等职务。, Smart Manufacturing for Si, SiC, GaN Power Devices in AI Era / 在人工智能时代，智能制造Si, SiC, 和GaN电力器件. Main relevance of heterogeneous system integration is to address the needs of complex functionality cost targets and time to market for products in the application areas such as Industry 4.0, Artificial Intelligence (AI), Internet of Things (IoT), Cyber Physical Systems (CPS), , Ambient Assisted Living (AAL) autonomous driving etc.. Today‘s system integration technologies are driven by System in Package (SiPs) approaches. China wants to build a coterie of technology giants that can stand shoulder-to-shoulder with Intel Corp. and Taiwan Semiconductor Manufacturing … After university, Karl joined for 3 years the central research and advanced development organization of Siemens where he worked on automatic test pattern generation techniques for different failure models, synthesis for testability in cooperation with university of Berkeley, and the application of build-in-self-test methods in VLSI circuits. Santosh Kumar is currently working as the Director & Principal Analyst, Packaging, Assembly, Substrates & Semiconductor Manufacturing. China International Semiconductor Expo (IC China 2021) is an exhibition that presents products and services in categories such as: China International Semiconductor Expo (IC China 2021) will be held in Shanghai, China on 27-29 Sep 2021. Ben obtained his Bachelor degree from Tsinghua University in automotive engineering and Master degree in electrical engineering from North Carolina State University in 1993. multi-level co-optimization, con-current design, failure analysis, and 3D packaging, etc.) Dr. WEI is now professor of Tsinghua University and adjunct professor of Peking University. Since 2017, Dr. Li has been the Chairman of Simgui. Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics. E.h. Herbert Reichl. There are plenty of lessons to be learned on how all the stakeholders should collaborate to ensure a sustainable development of the AI ecosystem and focus on areas where we should innovate towards a future with Sustainable AI. Especially, advantages of higher production efficiency, more advanced process, better supply chain, and cost-efficient in CMOS compatible manufacturing are achievable in 8 inch GaN on Si. Huawei designs its own high-end chipsets but cannot produce them in-house. He led the development of the first mobile phone chip solution (Holly Communication’s CDMA), the first TD-SCDMA mobile phone chip solution (Datang Mobile), and the first WCDMA mobile phone chip solution (Huawei Hisilicon) in China, as well as the first set of WCDMA base station chipset in the world. The talk will conclude with a call for broad collaboration across industry and academia in multiple areas including technology R&D, design, standardization and supply chain development. Maoka joined Renesas in 2013 as Vice President of Corporate Planning and led the turnaround of the company after capital injection by Japanese sovereign private equity fund, INCJ. Jointed Xilinx since 1993, he has worked from 0.6um till 7nm currently, more than 14 generations of technologies and products, from many foundries. China has made progress in chip design — Huawei successfully developed its in-house premium-tiered chip, Kirin, for its 5G equipment and flagship smartphones. Mr. Shen holds B.S. Lilly brings a broad set of industry experiences, including semiconductor, automotive, ecommerce, and manufacturing in both the US and China. Having worked and lived in mainland China, Hong Kong, USA, Philippines and Malaysia, he has built business successes with end customers in the areas of mobile phone chipset, wireline and wireless networking infrastructure, IoT, storage, DSL/PON gateway, surveillance, network security, and cloud/data center. He has incubated, invested and mentored various technology startups in China, Singapore and USA and has more than 30 years of experience in the technology and strategy advisory services in Asia, US and Europe where he has advised many Fortune 500 companies on enterprise digital transformation across multiple generations of technology evolution. Prior to his work with 0eC, he was working in the telecommunication and automotive branch as a system engineer and a freelance IT consultant for more than 10 years, and he has worked in projects for process analysis and customisable system administration. From 2000 until 2010 he additionally took over the position of personal assistant for the director of Fraunhofer IZM – Prof. Dr.-Ing. China could leverage technological change and find catch-up opportunities elsewhere. Lilly received her bachelor and master degrees in Electrical Engineering from the University of Southern California. In China, state investment traditionally led to high volumes of low-quality production, like in the steel industry.
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